C101 Oxygen Free Copper (OFE)
Mitsubishi Copper
Mitsubishi Copper
Electronic Devices
99.99% Cu min
5 ppm Oxygen max
Density
.323 lb/in³
Electrical Resistivity
max ohm-g/in
Thermal Conductivity
BTU in/ft² ⋅ h ⋅ °F −133
Rockwell 30T | Grain Size (max) | Tensile KSI* | |
Annealed (soft) | .050mm | ||
¼ hard | 18 - 51 | 34 - 42 | |
½ hard | 43 - 57 | 37 - 46 | |
¾ hard | 47 - 59 | 41 - 50 | |
hard | 54 - 62 | 43 - 52 | |
extra hard | 56 - 64 | 47 - 56 | |
spring | 60 - 66 | 50 - 58 | |
extra spring | 61 & over | 52 & over |
Available in coil or straight lengths
Thickness
.002" - .125
Width (thickness of .002" - .008")
4.00" max
Width (thickness of .008" & up)
6.00" max
© 2005 J.L. Anthony & Company. All rights reserved.