C101 Oxygen Free Copper (OFE)
Mitsubishi Copper
Application
Electronic Devices
Chemical Composition (Nominal %)
99.99% Cu min
5 ppm Oxygen max
Physical Characteristics
Density
.323 lb/in³
Electrical Resistivity
max ohm-g/in
- 0.15176
- soft (annealed)
- 0.15614
- cold rolled tempers
Thermal Conductivity
BTU in/ft² ⋅ h ⋅ °F −133
- 101%
- soft (annealed)
- 98.16%
- cold rolled tempers
Tempers
| Rockwell 30T | Grain Size (max) | Tensile KSI* | |
| Annealed (soft) | .050mm | ||
| ¼ hard | 18 - 51 | 34 - 42 | |
| ½ hard | 43 - 57 | 37 - 46 | |
| ¾ hard | 47 - 59 | 41 - 50 | |
| hard | 54 - 62 | 43 - 52 | |
| extra hard | 56 - 64 | 47 - 56 | |
| spring | 60 - 66 | 50 - 58 | |
| extra spring | 61 & over | 52 & over |
Sheet/Coil Sizes
Available in coil or straight lengths
Thickness
.002" - .125
Width (thickness of .002" - .008")
4.00" max
Width (thickness of .008" & up)
6.00" max